Submissions to this topic area should be targeted at specific applications, such as data center, automotive, bio-medical, free-space communication, LiDAR, imaging, sensing, artificial intelligence, quantum photonics, astro-photonics, etc. The submissions can be related to emerging applications in existing application domains or entirely new application domains.
Submissions to this topic area should focus on the methods of electro-photonic integration and system building. This includes electronic and photonic co-design, hybrid and monolithic integration approaches, programable photonic systems, microwave photonics, and advanced assembling, packaging and testing solutions.
Novel materials and material combinations and structures that are enabling new functions, new properties or science, and nanophotonic structures. Materials, structures, phenomena and devices that are still in an investigative stage, or that are not necessarily targeting specific application requirements. Examples include, but are not limited to, amorphous or disordered materials, 1D, 2D or 3D nanomaterials, phase change materials, functional oxides, ferroelectrics, photonic crystals, optical metamaterials, plasmonics and their hybrids.
New device concepts, fabrication processes, and characterization methods for group IV photonic devices. A broad range of device functionalities will be considered, including, but not limited to, on-chip light sources, high-speed modulation, photo-detection, optical coupling, filtering and routing, optical switching, polarization handling, wavelength and mode division multiplexing, metamaterial engineered devices, optical phased arrays, reconfigurable photonic devices, as well as devices aimed at sensing. Contributions should focus on specific device functionalities and innovations rather than complete systems; more complex circuits should be submitted to the integrated systems topic or the applications topic.